Stress release mold for thermal setting compositions and systems thereof
US7159834B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2005 |
| Grant date | Jan 9, 2007 |
| Priority date | — |
| Expiry date | Aug 3, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C39/006
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A stress-release mold is described for casting thermosetting compositions especially compositions designed for consumer use. At least one wall of the mold includes a stress-releasing-element characterized by having a more flexible region or regions than the remaining wall or walls of the mold and wherein the stress-releasing-element includes a region of lower curvature at least partially surrounded by a region of higher curvature. The stress-release mold greatly reduces or eliminates surface defects caused by shrinkage of thermosetting compositions as they cools. A system is also described that includes the inventive mold containing a thermosetting composition wherein the mold also serves as all or part of the package for the composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.