Mounting arrangement and method
US7160066B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 26, 2004 |
| Grant date | Jan 9, 2007 |
| Priority date | — |
| Expiry date | Jun 9, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T409/309016
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A mounting arrangement 1 is provided in which clamping pairs comprising a clamping pad 2 and seating pads 3 are arranged about a mounting end of a component 4. Thus, the component 4 is appropriately presented to a machining device but the component 4 can slip relative to the pads 2, 3 in order to relieve residual stresses in the component due to initial forging processes. A damper 8 is provided in order to augment vibration control in association with the contact abutments between the pads 2, 3. In such circumstances accurate machining of a component 4 to a final profile 6 from an initial rough profile 5 can be achieved more efficiently without periodic release of the component 4 so that distortions are avoided in the final component as a result of retained residual stresses by previous clamping.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.