Layered support and method for laminating CMP pads
US7160413B2 · kind B2 · utility
4Cited by
32References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2004 |
| Grant date | Jan 9, 2007 |
| Priority date | — |
| Expiry date | Sep 14, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B37/12
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A device and method for laminating CMP pads includes supporting the CMP pad with a board having material compositions similar to the CMP pad. By thus supporting the CMP pad during lamination, there is less likelihood of damage to the CMP pad and better adhesion from lamination. In particular, the CMP pad materials are laminated while in contact with a first board that may have a recess to accept the CMP pad. The pad has dimensions that are equal to or greater than the pad material. In an alternative embodiment, a board is provided on the opposite side of the CMP pad for lamination.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.