Plating machine and process for producing film carrier tapes for mounting electronic parts
US7160428B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 4, 2004 |
| Grant date | Jan 9, 2007 |
| Priority date | — |
| Expiry date | Mar 31, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1545
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A plating machine for plating a film carrier tape for mounting electronic parts includes a plating tank for plating wiring patterns of a film carrier tape and also has a bubble adhesion prevention means that is position adjustable with respect to the surface of a plating solution contained in the plating tank. The process for producing film carrier tapes for mounting electronic parts comprises partially immersing a film carrier tape in a plating solution contained in a plating tank and selectively plating wiring patterns formed in the immersed area while adsorbing bubbles generated in the plating solution to a bubble adhesion prevention means arranged at the surface of the plating solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.