LED package including a frame
US7161189B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 1, 2005 |
| Grant date | Jan 9, 2007 |
| Priority date | — |
| Expiry date | Jun 1, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
Abstract
A power LED package module includes a frame, a chip heat-conductive support, a light-emitting chip and a package body. The frame has a conductive pin, and a support separated from the conductive pin and connecting to the chip heat-conductive support. The light-emitting chip is arranged on the chip heat-conducting support and electrically connected to the conductive pin. The frame, the chip heat-conducting support and the light-emitting chip are packaged via the package body. The chip heat-conducting support is partially exposed out of the package body for connecting to a heat-dissipating element for increasing the efficiency of heat dissipation of the power LED package module. The power LED package module thus provides electrical conduction and heat conduction in a split manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.