System and apparatus for socket and package power/ground bar to increase current carrying capacity for higher IC power delivery
US7161243B2 · kind B2 · utility
0Cited by
40References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 20, 2005 |
| Grant date | Jan 9, 2007 |
| Priority date | — |
| Expiry date | May 20, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A socket and package apparatus are disclosed for increasing the amount of power that can be delivered from an IC board to an IC where the IC package is mounted in a socket connected to the IC board. In one embodiment, the IC package includes a first power plane along with a power carrier and one or more pin receptacles. The power bar carrier includes a first conducting panel that is electrically coupled to the first power plane along a first adjacent edge. The first conducting panel is also electrically coupled to a first plurality of conducting pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.