Method and apparatus for probe tip contact
US7161366B2 · kind B2 · utility
4Cited by
7References
46Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2004 |
| Grant date | Jan 9, 2007 |
| Priority date | — |
| Expiry date | Nov 28, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2831
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The invention is a method and apparatus for a probe tip contact for electrically coupling a substrate to a probe tip. The apparatus, in one embodiment, comprises a wrap-around contact that is precision formed utilizing a hydroform tool and brazed to a surface of a substrate. In another embodiment, the apparatus comprises a contact flange, a mounting flange extending from a first edge of the contact flange in an orientation substantially perpendicular to the contact flange, and a substantially circular indentation formed in the contact flange adapted for accommodating movement of said probe tip relative to said substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.