Heat spreader module
US7161807B2 · kind B2 · utility
8Cited by
6References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 20, 2004 |
| Grant date | Jan 9, 2007 |
| Priority date | — |
| Expiry date | Sep 17, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat spreader module includes a base, a heat spreader member arranged on the base, a thermal conductive layer arranged on the heat spreader member, a first joining member interposed between the base and the heat spreader member, and a second joining member interposed between the heat spreader member and the thermal conductive layer. The base comprises a copper alloy which has a proof stress of not less than 45 MPa and a coefficient of thermal conductivity of not less than 270 W/mK after performing a heat treatment between 600° and 900° C. for 10 minutes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.