Monitoring an optical element of a processing head of a machine for thermal processing of a workpiece
US7162140B2 · kind B2 · utility
4Cited by
3References
29Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 16, 2004 |
| Grant date | Jan 9, 2007 |
| Priority date | — |
| Expiry date | Jul 16, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/157
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus for monitoring soiling of an optical element of a processing head of a machine for laser processing of a workpiece includes a first transparent optical element, positioned in a path of a laser beam, a second transparent optical element, positioned in the path of a laser beam and separated from the first transparent optical element by a gap, a first detector for detecting laser light scattered from the first transparent optical element, and a second detector for detecting laser light scattered within the gap between the first transparent optical element and the second transparent optical element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.