Heat dissipating device
US7163050B2 · kind B2 · utility
9Cited by
11References
15Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jun 29, 2005 |
| Grant date | Jan 16, 2007 |
| Priority date | — |
| Expiry date | Jun 29, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipating device for a CPU includes a chassis (10), a heat sink (20), a fan cover (50) and a fan (60). The heat sink includes a coin-shaped connecting piece (22) and a plurality of cooling fins (30) arranged radially and defining an inter space for receiving the connecting piece. A plurality of airflow passages is formed between adjacent cooling fins. A plurality of heat pipes (40) is attached to a periphery of the cooling fins and the chassis. The fan cover partially surrounds the heat sink. The fan is secured to the fan cover to provide forced airflow through the airflow passages of the cooling fins radially.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.