High temperature isostatic pressure bonding of hollow beryllium pressure vessels using a bonding flange
US7163121B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 5, 1999 |
| Grant date | Jan 16, 2007 |
| Priority date | — |
| Expiry date | Nov 5, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A bond joint and process of bonding metal parts to one another to form seamless, hollow metal articles, particularly made from beryllium. Tooling is assembled to the parts, prior to hot pressing, to cause pressure to be applied to flanges that extend peripherally from the parts. The parts, assembled together with the tooling, are then subjected to hot isostatic pressing of the flanges at a temperature of about 1700° F. to 1750° F., and at a pressure of about 2000 psi to 2500 psi, for around 3 hours. The tooling surrounding the metal parts functions to limit the amount of compression of the flanges. Articles formed by this process are particularly useful in space flight applications because they are formed of a homogeneous material. This means that the articles can operate under high pressure despite being subjected to temperature cycling. Strength of the bond joint is enhanced because no filler metal is used. The absence of a filler metal also eliminates any thermal stress problems as a result of differences in coefficients of thermal expansion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.