Method for making dense crack free thin films
US7163713B2 · kind B2 · utility
10Cited by
51References
75Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 3, 2002 |
| Grant date | Jan 16, 2007 |
| Priority date | — |
| Expiry date | Apr 27, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The process described herein provides a simple and cost effective method for making crack free, high density thin ceramic film. The steps involve depositing a layer of a ceramic material on a porous or dense substrate. The deposited layer is compacted and then the resultant laminate is sintered to achieve a higher density than would have been possible without the pre-firing compaction step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.