Patent · US Expired

Method for making dense crack free thin films

US7163713B2 · kind B2 · utility

10Cited by
51References
75Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 3, 2002
Grant dateJan 16, 2007
Priority date
Expiry dateApr 27, 2023

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02P70/50
  • WIPO fieldChemical engineering
  • WIPO sectorChemistry

Abstract

The process described herein provides a simple and cost effective method for making crack free, high density thin ceramic film. The steps involve depositing a layer of a ceramic material on a porous or dense substrate. The deposited layer is compacted and then the resultant laminate is sintered to achieve a higher density than would have been possible without the pre-firing compaction step.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.