Heat-curable silicone adhesive complex whereof the interface has release force capable of being modulated
US7163720B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 24, 2000 |
| Grant date | Jan 16, 2007 |
| Priority date | — |
| Expiry date | Apr 11, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention concerns a silicone/adhesive complex comprising at least a silicone coating applied on a first support and an adhesive coating applied on a second support, and whereof the release force of a silicone/adhesive interface is capable of being modulated. The invention is characterized in that its silicone coating results from heat polymerization and/or curing of: either monomers, oligomers and/or polymers bearing at least a reactive Si—H structural unit and monomers, oligomers and/or polymers bearing at least a reactive unsaturated aliphatic group; or monomers, oligomers and/or polymers bearing at least a reactive Si—OH structural unit; or monomers, oligomers and/or polymers bearing at least a reactive Si—H structural unit and monomers oligomers and/or polymers bearing at least a reactive epoxy, oxetane and/or dioxolane unit; and said silicone coating further comprises at least an additive adjusting the release force of a silicone/adhesive interface and whereof the activity is photochemically initiated and adjustable.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.