Adhesive for bonding to low surface energy surfaces
US7163741B2 · kind B2 · utility
30Cited by
63References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2003 |
| Grant date | Jan 16, 2007 |
| Priority date | — |
| Expiry date | Aug 3, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31855
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A novel polymodal asymmetric elastomeric block copolymer and a pressure sensitive adhesive, tape and adhesive backed article made therefrom, such as a polymer foam article having a substantially smooth surface prepared by melt-mixing a polymer composition and a plurality of microspheres, at least one of which is an expandable polymeric microsphere, under process conditions, including temperature and shear rate, selected to form an expandable extrudable composition; and extruding the composition through a die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.