Thermal barrier composition
US7163750B2 · kind B2 · utility
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29References
7Claims
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Assignee
Inventor
Key dates
| Filing date | Oct 7, 2004 |
| Grant date | Jan 16, 2007 |
| Priority date | — |
| Expiry date | Jun 11, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The thermal barrier composition of the present invention provides polymethylsilsesquioxane dissolved in a crosslinking agent, and a filler and/or hollow glass microspheres.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.