Patent · US Expired

Semiconductor module with scalable construction

US7164201B2 · kind B2 · utility

17Cited by

1References

5Claims

0Family size

Assignee

SEMIKRON ELEKTRONIK GMBH & CO. KG · DE

Inventors

Yvonne Manz · Weisendorf, DE
Jürgen Steger · Hiltpoltstein, DE
Thomas Stockmeier · Baden, CH

Key dates

Filing date	Jul 23, 2004
Grant date	Jan 16, 2007
Priority date	—
Expiry date	Jul 23, 2024

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/49175
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A power semiconductor module with a scalable construction, having a base plate or intended for direct mounting on a heat sink. The module has a framelike housing, a cover, terminal elements, extending to the outside of the housing for load contacts and auxiliary contacts. The module having at least two electrically insulating substrates disposed inside the housing, which in turn each comprise one insulating body and a plurality of metal conducting tracks, located on the first main face of the insulating body, which first main face is remote from the base plate or the heat sink. The metal connecting tracks are electrically insulated from one another, and power semiconductor components are located on and electrically connected to these connecting tracks. The substrates (50) are identical, and electrically connected to one another, and have the same type and number of power semiconductor components disposed thereon.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.