Packaging for an interferometric modulator
US7164520B2 · kind B2 · utility
54Cited by
220References
39Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 12, 2004 |
| Grant date | Jan 16, 2007 |
| Priority date | — |
| Expiry date | May 12, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B26/001
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate is provided and a desiccant is applied to the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.