Modular chassis divided along a midplane and cooling system therefor
US7164581B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2004 |
| Grant date | Jan 16, 2007 |
| Priority date | — |
| Expiry date | Jun 21, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20572
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A chassis divides vertically, with front and rear sections of the chassis joined immediately adjacent a midplane printed circuit board that supports interconnectivity of electronic circuits. Wiring within the chassis is eliminated through directed connections of all components to the midplane. Minimal hardware is required for securing the front and rear sections together, and therefore accessing the midplane for assembly and service is convenient. All components except the midplane are installed and removed from either the front or rear of the chassis without opening or disassembling the chassis. The chassis layout and features facilitate effective cooling of the components in the chassis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.