Method of fabricating optical waveguide devices with smooth and flat dielectric interfaces
US7164837B2 · kind B2 · utility
4Cited by
8References
15Claims
0Family size
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Key dates
| Filing date | Dec 3, 2003 |
| Grant date | Jan 16, 2007 |
| Priority date | — |
| Expiry date | May 6, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/12173
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
One or more embodiments of the instant invention may be briefly summarized as follows. A planarization and smoothing segment includes: (a) a reverse mask and etching method; a sacrificial layer and selective CMP followed by non selective CMP; or a sacrificial layer and selective etching followed by non-selective CMP. A buffer layer to protect wave guide segment includes: (a) waveguide formation followed by buffer layer deposition; or a buffer deposition over the waveguide layer followed by waveguide formation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.