Systems and methods for modular component deployment
US7165249B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2003 |
| Grant date | Jan 16, 2007 |
| Priority date | — |
| Expiry date | Oct 12, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F9/44521
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An integration component such as an application integration engine can be bundled as a single, self-contained J2EE Enterprise archive (EAR) file. The bundling of the component into an EAR file enables the component to be deployed to any valid system domain that is running and available. A recycling of the server then may be necessary only if a Java archive file is added to the classpath for non-system domains.This description is not intended to be a complete description of, or limit the scope of, the invention. Other features, aspects, and objects of the invention can be obtained from a review of the specification, the figures, and the claims.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.