Method of making a surface acoustic wave device
US7165298B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2004 |
| Grant date | Jan 23, 2007 |
| Priority date | — |
| Expiry date | May 5, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A surface acoustic wave die system and method are disclosed herein, including a surface acoustic wave sensor comprising one or more surface acoustic wave die disposed and hermetically sealed between a base and a cover. An adhesive is generally for securing one or more of the surface acoustic wave die to the base, which is configured with a pattern of cross hatches formed thereon in order to permit the adhesive to adhere to the base. The adhesive is placed under a location wherein surface acoustic wave die is to be located. The surface acoustic wave die is thereafter pressed into the adhesive, whereby upon a subsequent curing of the adhesive, the surface acoustic wave die is held securely in place, while remaining flexible as required by sensing applications associated with the surface acoustic save sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.