Patent · US Expired

Sensor module having a sensor element surrounded by a heating element

US7165441B2 · kind B2 · utility

4Cited by

21References

13Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Michael Bauer · Unterföhring, DE
Isolde Simon · Aspenhausiedlung, DE
Michael Arndt · Franklin, US

Key dates

Filing date	Aug 27, 2002
Grant date	Jan 23, 2007
Priority date	—
Expiry date	Mar 20, 2023

Classification

Technology area (CPC G)Physics
CPC primaryG01N27/18
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A sensor module having a heating structure and a sensor element is described. The heating structure surrounds the sensor element so that heat dissipation through a frame is largely prevented. This yields a greater measuring accuracy of the sensor module. In particular, interfering influences due to a temperature dissipation through the mount frame are thereby prevented.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.