Surface acoustic wave sensor methods and systems
US7165455B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2004 |
| Grant date | Jan 23, 2007 |
| Priority date | — |
| Expiry date | May 4, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L9/0025
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Sensor systems and methods are disclosed herein, including a sensor chip, upon which at least two surface acoustic wave (SAW) sensing elements are centrally located on a first side (e.g., front side) of the sensor chip. The SAW sensing elements occupy a common area on the first side of the sensor chip. An etched diaphragm is located centrally on the second side (i.e., back side) of the sensor chip opposite the first side in association with the two SAW sensing elements in order to concentrate the mechanical strain of the sensor system or sensor device in the etched diagram, thereby providing high strength, high sensitivity and ease of manufacturing thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.