Chemically bonded aggregate mold
US7165600B2 · kind B2 · utility
5Cited by
55References
42Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 10, 2003 |
| Grant date | Jan 23, 2007 |
| Priority date | — |
| Expiry date | Oct 26, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22D29/002
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A mold for the casting of metals including an aggregate comprising a refractory particulate material and a soluble binder which provides for minimal heat transfer between the mold and the molten metal during filling. The aggregate preferably includes at least a proportion of particulate material having a heat diffusivity at least as low as silica sand to reduce the chilling effect of the mold. The mold is removed from the casting the action of a solvent, which simultaneously cools and solidifies the casting at a maximum rate. Processes for forming the mold and the casting of metals using the mold are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.