Resistor protective layer for micro-fluid ejection devices
US7165830B2 · kind B2 · utility
4Cited by
6References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 14, 2004 |
| Grant date | Jan 23, 2007 |
| Priority date | — |
| Expiry date | Jan 1, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/03
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A heater chip for a micro-fluid ejection device having enhanced adhesion between a resistor layer and a protective layer. The heater chip includes a substrate, a resistive layer deposited adjacent to the substrate, and a substantially non-conductive protective layer adjacent to the resistive layer. The protective layer is selected from a titanium-doped diamond-like carbon thin film layer, and a single thin film diamond-like carbon layer having at least a first surface comprised of more than about 30 atom % titanium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.