Use of microcapsules in gypsum plasterboards

US7166355B2 · kind B2 · utility

Assignee

• BASF SE

Inventors

• Ekkehard Jahns · Weinheim, DE
• Hans-Jurgen Denu · Friedelsheim, DE
• Joachim Pakusch · Ludwigshafen, DE
• Horst Seibert
• Marco Schmidt · Stuttgart, DE

Key dates

• Filing date: Aug 7, 2002
• Grant date: Jan 23, 2007
• Expiry date: Aug 16, 2022

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/2989
• WIPO field: Materials, metallurgy
• WIPO sector: Chemistry

Abstract

The invention relates to the use of microcapsules with latent heat storage materials as capsule cores on gypsum plasterboards, gypsum plasterboards containing the same and a method for production thereof.