Hot melt adhesive composition
US7166662B2 · kind B2 · utility
4Cited by
7References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 7, 2003 |
| Grant date | Jan 23, 2007 |
| Priority date | — |
| Expiry date | Aug 29, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2493/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A low application temperature, high heat resistant hot melt adhesive comprising an ethylene n-butyl acrylate copolymer having a melt index (MI) of 750 grams/10 minutes or higher and an ethylene vinyl acetate (EVA) polymer having a MI of 750 grams/10 minutes or higher are particularly well suited for case and carton sealing operations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.