Miniature silicon condenser microphone
US7166910B2 · kind B2 · utility
189Cited by
40References
33Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 21, 2001 |
| Grant date | Jan 23, 2007 |
| Priority date | — |
| Expiry date | Oct 9, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4908
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A silicon condenser microphone package is disclosed. The silicon condenser microphone package comprises a transducer unit, a substrate, and a cover. The substrate includes an upper surface having a recess formed therein. The transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate. The cover is placed over the transducer unit and includes an aperture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.