Beam shaping optics and module for a diode laser arrangement

US7167312B2 · kind B2 · utility

Assignee

• TRUMPF Laser GmbH + Co. KG · DE

Inventors

• Andreas Voss · Essen, DE
• Martin Huonker · Rottweil, DE
• Martin Liermann · Villingen-Schwenningen, DE
• Klaus Wallmeroth · Camburg, DE
• Malte Kumkar · Weimar, DE
• Friedheim Dorsch · Camburg, DE
• Christian Schmitz · Wilrijk, BE

Key dates

• Filing date: May 27, 2005
• Grant date: Jan 23, 2007
• Expiry date: Jun 9, 2025

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01S5/4025
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

A beam shaping optical arrangement combines three incoming laser beams that are mutually laterally offset in two orthogonal directions (X and Y), including an incoming first central laser beam and second and third incoming beams laterally offset in the X direction on either side of the central beam, into one outgoing combined laser beam. The arrangement includes two lateral displacement optical units though which the laterally offset incoming beams are transmitted and that laterally displace the two laterally offset incoming beams along the X direction towards the incoming central beam but which do not laterally offset the incoming central beam. The lateral displacement units include a material having a higher refractive index than a medium located in an optical path of the central laser beam, and the optical path length traversed by the incoming laterally offset laser beams is selected such that, after transmission though the optical units, the diameters of the central laser beam and the laterally offset laser beams are approximately equal at least in the X direction, and a divergence of the central laser beam is approximately equal to a divergence of the laterally offset laser be…