Methods and apparatus for installing a heat sink using surface mount technology
US7167369B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2003 |
| Grant date | Jan 23, 2007 |
| Priority date | — |
| Expiry date | Oct 17, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T24/45581
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board module includes a circuit board having surface mount pads, a circuit board component mounted to the circuit board, and a heat sink assembly. The heat sink assembly includes a heat sink, a first clip holder and a second clip holder. Each clip holder is mounted to respective surface mount pads of the circuit board using a surface mount technology soldering process. The heat sink assembly further includes a clip having a first portion configured to fasten to the first clip holder, a second portion configured to fasten to the second clip holder, and a third portion coupled to the first and second portions. The third portion is configured to position the heat sink adjacent the circuit board component when the first and second portions are respectively fastened to the first and second clip holders.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.