Stacking multiple devices using flexible circuit
US7167373B1 · kind B1 · utility
16Cited by
5References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2004 |
| Grant date | Jan 23, 2007 |
| Priority date | — |
| Expiry date | Jan 19, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
One embodiment of the invention includes a flexible circuit and a stiffener. The flexible circuit has first, second, and third portions. The first portion is folded on an upper surface of the third portion and has first contact elements attached to a first device. The second portion is folded on the first device and has second contact elements attached to a second device. The stiffener is attached to the upper surface of the third portion and located between the upper surface of the third portion and the first portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.