Multilayer wiring board, method of mounting components, and image pick-up device
US7167376B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 14, 2004 |
| Grant date | Jan 23, 2007 |
| Priority date | — |
| Expiry date | Jan 16, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10515
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer wiring board on which multiple components are overlappingly mounted. The multilayer wiring board includes: a first surface on which a first component among the multiple components is mounted; and a second surface whose height in a thickness direction of the multilayer wiring board is smaller than that of the first surface, by which a step is provided between the first surface and the second surface, a second component among the multiple components being mounted on the second surface to partially overlap the first component in a non-contact manner, the second surface also having a light-transmitting window through which light is transmitted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.