Process and apparatus for improving and controlling the curing of natural and synthetic moldable compounds
US7167773B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 11, 2005 |
| Grant date | Jan 23, 2007 |
| Priority date | — |
| Expiry date | Mar 11, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C35/0288
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A process for curing a moldable compound under a plurality of curing conditions by: (1) obtaining time dependent data streams of dielectric or impedance values from a plurality of sensors distributed within a curing mold, wherein the moldable compound is a dialectric for each of the sensors; (2) determining impedance related measurements from the data streams for the plurality of sensors; (3) determining predictive and/or corrective curing actions for enhancing the curing process using the impedance related measurements for the plurality of sensors; and (4) controlling the mass production curing of parts to obtain cured parts having one or more desired properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.