Method for mounting and heating a plurality of microelectronic components
US7168160B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 21, 2001 |
| Grant date | Jan 30, 2007 |
| Priority date | — |
| Expiry date | Jul 8, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49222
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for heat-treating a plurality of microelectronic structures attached to a non-metallic substrate is disclosed. The method comprises the steps of: (a) placing the non-metallic substrate and the plurality of microelectronic structures in an oscillating electromagnetic field, whereby the plurality of microelectronic structures are heated by the oscillating electromagnetic field and the non-metallic substrate is essentially not heated by the oscillating electromagnetic field; (b) maintaining the non-metallic substrate and the plurality of microelectronic structures in the oscillating electromagnetic field until each of the plurality of microelectronic structures obtains a defined heat-treatment temperature substantially greater than an ambient temperature; (c) removing the non-metallic substrate and the plurality of microelectronic structures from the oscillating electromagnetic field; and (d) cooling the plurality of microelectronic structures to the ambient temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.