Methods for forming via shielding
US7168164B2 · kind B2 · utility
7Cited by
15References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 4, 2002 |
| Grant date | Jan 30, 2007 |
| Priority date | — |
| Expiry date | Apr 20, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods to shield conductive layer from via. A protective coating of insulating material is formed around a clearance hole in a conductive layer of a printed circuit board, so that the conductive material in a via within the clearance hole will not contact the conductive layer and create a short circuit. In one embodiment, the protective coating is sufficiently hard to deflect a drill bit being used to drill the via hole, thus protecting against misregistered drilled holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.