Movable-die support device and die clamping unit
US7168946B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2005 |
| Grant date | Jan 30, 2007 |
| Priority date | — |
| Expiry date | Apr 17, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2045/1788
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A support device for a movable die comprises a linear guide, a base, a movable platen, a driving mechanism which linearly moves the base, and a securing mechanism which secures the movable platen to the base. The base is guided by the linear guide and is linearly movable. A movable die is mounted to the movable platen, and the movable platen is mounted on the base. When the movable platen undergoes a deformation with a pressure of die clamping, the securing mechanism absorbs a displacement of the movable platen in a base movement direction or a vertical direction due to the deformation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.