Patent · US Expired

Movable-die support device and die clamping unit

US7168946B2 · kind B2 · utility

11Cited by
7References
14Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 28, 2005
Grant dateJan 30, 2007
Priority date
Expiry dateApr 17, 2025

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB29C2045/1788
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

A support device for a movable die comprises a linear guide, a base, a movable platen, a driving mechanism which linearly moves the base, and a securing mechanism which secures the movable platen to the base. The base is guided by the linear guide and is linearly movable. A movable die is mounted to the movable platen, and the movable platen is mounted on the base. When the movable platen undergoes a deformation with a pressure of die clamping, the securing mechanism absorbs a displacement of the movable platen in a base movement direction or a vertical direction due to the deformation.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.