End face polishing apparatus
US7169026B2 · kind B2 · utility
4Cited by
4References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2004 |
| Grant date | Jan 30, 2007 |
| Priority date | — |
| Expiry date | Oct 4, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B19/226
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An end face polishing apparatus has a jig plate for supporting at least one workpiece having an end face and a polishing plate mounted for undergoing movement. A polishing member is mounted on the polishing plate for undergoing movement therewith to polish the end face of the workpiece. A slidable contact member is disposed on the jig plate for slidable contact with the polishing plate during a polishing operation to thereby regulate a polishing amount of the end face of the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.