Fluorinated surfactants for buffered acid etch solutions
US7169323B2 · kind B2 · utility
10Cited by
15References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 8, 2002 |
| Grant date | Jan 30, 2007 |
| Priority date | — |
| Expiry date | Feb 3, 2025 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K13/08
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention is directed to certain fluorinated surfactants, and use thereof in acid etch solutions, such as in aqueous buffered acid etch solutions. The etch solutions are used with a wide variety of substrates, for example, in the etching of silicon oxide-containing substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.