Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof
US7169327B2 · kind B2 · utility
15Cited by
16References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 24, 2002 |
| Grant date | Jan 30, 2007 |
| Priority date | — |
| Expiry date | Jan 25, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2998
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The dielectric-forming composition according to the invention is characterized by consisting of: In addition, another dielectric-forming composition according to the invention is characterized by containing:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.