Dicopper(I) oxalate complexes for use as precursor substances in metallic copper deposition
US7169947B2 · kind B2 · utility
1Cited by
2References
24Claims
0Family size
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Key dates
| Filing date | Jun 5, 2003 |
| Grant date | Jan 30, 2007 |
| Priority date | — |
| Expiry date | Jun 5, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/105
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
The invention relates to dicopper(I) oxalate complexes stabilised by neutral Lewis base components and to the use thereof as precursors for the deposition of metallic copper. The neutral Lewis bases used are alkynes or alkenes containing at least one silyl or ester group, or nitrites, saturated or unsaturated nitrogen ligands, phosphites, trialkyl-phosphines or oxygen- or sulfur-containing ligands.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.