Semi-fusible link system for a multi-layer integrated circuit and method of making same
US7170148B2 · kind B2 · utility
0Cited by
4References
30Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 12, 2004 |
| Grant date | Jan 30, 2007 |
| Priority date | — |
| Expiry date | Mar 14, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A semi-fusible link system and method for a multi-layer integrated circuit including active circuitry on a first layer having a metal one layer including a semi-fusible link element on a second layer having a metal two layer adapted for interconnecting with the metal one layer, and a selector circuit disposed on the first layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.