Apparatus and method for inspecting interface between ground layer and substrate of microstrip by using scattering parameters
US7170300B2 · kind B2 · utility
1Cited by
7References
12Claims
0Family size
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Key dates
| Filing date | Aug 12, 2004 |
| Grant date | Jan 30, 2007 |
| Priority date | — |
| Expiry date | Aug 12, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R27/28
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus and method for detecting a defect on a ground layer of microstrip by using scattering parameters is disclosed. The apparatus includes: a providing unit for providing a signal to the microstrip by changing a frequency of the signal in a predetermined range of frequencies; a detecting unit for detecting scattering parameters of an output signal from the microstrip in response to the frequency of the signal; and an analyzing unit for analyzing the interface based on the scattering parameters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.