Optical sub-assembly having an enhanced discharge-resistant arrangement and an optical transceiver using the same
US7172348B2 · kind B2 · utility
3Cited by
0References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 19, 2005 |
| Grant date | Feb 6, 2007 |
| Priority date | — |
| Expiry date | Apr 19, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4292
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical assembly of the present invention comprises a package installing a semiconductor optical device therein, a metal sleeve attached to the package, and the resin holder disposed between package and the sleeve member. When this optical assembly is installed within the optical transceiver and even the metal sleeve extrudes into the optical receptacle and is exposed to the outside there, the EMI noise can be prevented from importing into the transceiver and radiating to the outside, because the resin holder made of substantially insulating material is disposed between the sleeve and the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.