Injection molding valve pin bushing
US7172409B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 22, 2004 |
| Grant date | Feb 6, 2007 |
| Priority date | — |
| Expiry date | Mar 31, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2045/2889
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A valve pin bushing for a valve gated injection molding apparatus having, a back plate, a valve pin bushing, and a manifold, with axially aligned respective valve pin bores. The valve pin bushing includes a back plate contacting surface and an opposite manifold contacting surface for bearing against the back plate and manifold, respectively. The back plate contacting surface has a surface area larger than a surface area of the manifold contacting surface to draw heat from the valve pin bushing to the cooler back plate. An air gap, which may be sealed by an optional sealing portion, is formed where the flange is spaced away from a central portion of the valve pin bushing near the manifold. The valve pin bushing also includes a tubular member for positioning within the manifold valve pin bore, which defines a portion of the manifold melt passageway.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.