Structure of bonding plastic part insert-molded with wiring board and method of bonding the same
US7172469B2 · kind B2 · utility
0Cited by
3References
13Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Sep 12, 2003 |
| Grant date | Feb 6, 2007 |
| Priority date | — |
| Expiry date | Sep 21, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/065
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In insert-molding a wiring board, at either one of a surrounding of a holding hole of the wiring board provided at a first plastic part and a second plastic part opposed thereto, a hole side projected portion capable of being brought into contact with a bonding face of other thereof is provided, and the surrounding of the holding hole in the first plastic part and the second plastic part are bonded to each other by melting the hole side projected portion by applying ultrasonic wave to bonding portions of the two plastic parts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.