Composition and method relating to a hot melt adhesive
US7173076B2 · kind B2 · utility
0Cited by
22References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 3, 2003 |
| Grant date | Feb 6, 2007 |
| Priority date | — |
| Expiry date | Sep 13, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/04
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention includes methods and compositions relating to a hot melt adhesive that includes ethylene methyl methacrylate and a tackifying resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.