Thickness measuring apparatus and method using a microwave cavity resonator
US7173435B1 · kind B1 · utility
10Cited by
5References
27Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 27, 2006 |
| Grant date | Feb 6, 2007 |
| Priority date | — |
| Expiry date | Jan 27, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B15/02
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A measurement device for measuring a thickness of a film layer over a substrate utilizes a microwave source and a resonant cavity having an open side. A microwave signal is introduced at a first end of the resonant cavity with the open side against a surface measurement sample having a film layer over a substrate, and an output signal detector senses the output power of the signal at a far end of the resonant cavity. A processor uses a difference in the resulting resonant frequency of the cavity from that using a substrate without the film layer to determine the thickness of the film layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.