Reducing the coupling between LC-oscillator-based phase-locked loops in flip-chip ASICs
US7173498B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2004 |
| Grant date | Feb 6, 2007 |
| Priority date | — |
| Expiry date | Dec 6, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed are integrated circuits having multiple electromagnetically emissive devices, such as LC oscillators. The devices are formed on an integrated circuit substrate and are given different planar orientations from each other. Particular integrated circuit packages disclosed are “flip-chip” packages, in which solder bumps are provided on the integrated circuit substrate for flipping and mounting of the finished integrated circuit upon a printed circuit board or other substrate. The solder bumps provide conductive connections between the integrated circuit and the substrate. The orientations and positioning of the emissive devices are such that one or more of the solder bumps are interposed between neighboring emissive devices to act as an electromagnetic shield between them.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.