Memory card production using prefabricated cover and molded casing portion
US7174628B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 3, 2005 |
| Grant date | Feb 13, 2007 |
| Priority date | — |
| Expiry date | Aug 4, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Secure-digital (SD) type memory cards are produced using one or more prefabricated cover portions and a molded casing portion. A sub-assembly is formed by mounting a printed circuit board assembly (PCBA) onto the cover portion such that the contact pads of the PCBA are exposed through associated windows defined in the cover. The sub-assembly is placed into a cavity formed in a mold assembly, and molten thermoplastic material is then injected into each cavity of the mold assembly under heat and pressure using known injection molding techniques, thereby forming a molded plastic casing portion that secures the PCBA to the cover and completes the memory card housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.