De-packaging machine
US7174695B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Jun 2, 2004 |
| Grant date | Feb 13, 2007 |
| Priority date | — |
| Expiry date | Aug 26, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/654
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A de-packaging system for removing film and bands from packages includes a first conveyor configured to move packages. The de-packaging system also includes a loading station for loading packages onto the conveyor, and a film cutting station associated with the first conveyor. The film cutting station includes a cutter having an elongated cutting element that can be heated to cut film on packages. A band cutting station includes a cutter for cutting bands wrapped around packages. A clamp device includes a clamp configured to clamp bands on packages for removal of the bands. The de-packaging system further includes a second conveyor having an upstream end adjacent a downstream end of the first conveyor. A device applies force to packages to move packages from the first conveyor to the second conveyor, and at least one friction member strips film from packages as they are moved from the first conveyor to the second conveyor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.